PhD Students
Current PhD:
Justin Chow
Electroplated Nanowires as Thermal Interface Material |
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Trilochan Rambhatla
Study of Delamination of Bimaterials Under the Influence of Different Modes of Loading |
Ben Stewart
Mechanical Reliability and Characterization of Stretchable and Wearable Electronics |
Christine Taylor
Flip-chip Reliability Through Experimental Measurement |
Casey Woodrum
Thermomechanical Reliability of Microfluidic Channels |
Alumni PhD:
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Shashikant Hegde
Investigation of Optical Changes in Siloxane Polymer Waveguides During Thermal Curing and Aging 2008 |
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Injoong Kim
Development of a Knowledge Model for the Computer-Aided Design for Reliability of Electronic Packaging Systems 2008 |
Xi Liu
Experimental and Theoretical Assessment of Through-Silicon Vias for 3D Integrated Microelectronic Packages 2013 |
Dennis Lunyu Ma
Thermo-Mechanical Reliability of High Density Stress-Engineered Compliant Interconnects for Electronic Packaging Application 2003 |
Sakerthraman Mahalingam
Study of Interfacial Crack Propogation in Flip Chip Assemblies with Nano-filled Underfill Materials 2005 |
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Stelios Michaelides
Physics-Based Process Modeling, Reliability Prediction and Design Guidelines for Flip-Chip Devices 1999 |
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Andrew Perkins
Investigation and Prediction of Solder Joint Reliability for Ceramic Area Array Packages under Thermal Cycling, Power Cycling, and Vibration Environments 2007 |
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Krishna Tunga
Study of SnAgCu Alloy Reliability though Material Microstructure Evolution and Laser Moire Interferomety 2008 |
Weidong Xie
Thermo-Mechanical Evaluation of Interfacial Integrity in Multilayered Microelectronic Packages 2001 |
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Jiantao Zheng
Interfacial Fracture of Micro thin Film Interconnects under Monotonic and Cyclic Loading 2008 |
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