NextFlex (Flexible Hybrid Electronics Manufacturing Innovation Institute) Fellow, 2018
The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
Outstanding Achievement in Research Program Development Award (Team Leader), Georgia Institute of Technology, 2017
The George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology
Thomas French Achievement Award
Department of Mechanical and Aerospace Enginering, The Ohio state University, 2012
ASME/EPPD- Applied Mechanics Award
American Society of Mechancial Engineers Electronic and Photonic Packaging Division, 2012
Sustained Research Award
Sigma Xi, Georgia Institute of Technology, 2008
Cover Image, IEEE Transactions on Components and Packaging Technologies
Embedded Passives in Organic Structures:IEEE Transactions on Components and Packaging Technologies, March 2007. Lee, K. J., Damani, M., Pucha, R., Bhattacharya, S., Tummala, R., and Sitaraman, S. K., “Reliability Modeling and Assessment of Embedded Capacitors in Organic Substrates,” IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 1, 2007, pp. 152-162.
Outstanding Faculty Leadership Award for the Development of Graduate Research Assistants
Georgia Institute of Technology, 2006
Fellow – ASME International
Suresh K. Sitaraman, Ph.D., 2004
2004 Commendable Paper Award
IEEE Transactions on Advanced Packaging, “The SOP for Miniaturized, Mixed-Signal Computing, Communication, and Consumer Systems of the Next Decade,” R. R. Tummala, M. Swaminathan, M. M. Tentzeris, J. Laskar, G. K. Chung, S. Sitaraman, et al., May 2004
ASME/ABET Mechanical Engineering Evaluator
Selected by the Board of Engineering Education, ASME, Fall 2003-Present.
Cover Image, Helix Interconnects, IEEE Transactions on Advanced Packaging
May 2003. Zhu, Q., Ma, L., and Sitaraman, S. K., “Design Optimization of One-Turn Helix – a Novel Compliant Off-Chip Interconnect,” IEEE Transactions on Advanced Packaging, Vol. 26, No. 2, May 2003, pp. 106-112.
2001 Best Paper of the Year, IEEE Transactions on Components and Packaging Technologies
“Interfacial Fracture Toughness for Delamination Growth Prediction in a Novel Peripheral Array Package,” V. Sundararaman and S. K. Sitaraman
IMAPS Best Paper of the Session
International Symposium and Exhibition on Advanced Packaging Materials, IMAPS, March 2000, “Cure Kinetics Modeling of ViaLux 81: A Novel Epoxy Photo-Dielectric Film (PDDF) for Microvia Applications,” by Dunne, R. C., Sitaraman, S. K., Luo, S., Wong, C. P., Estes, W. E., and Periyasamy, M.
2000 Best Paper of the Year, IEEE Transactions on Components and Packaging Technologies
“Development of Virtual Reliability Methodology for Area-Array Devices used in Implantable and Automotive Applications,” S. Sitaraman, R. Raghunathan, and C. E. Hanna, 2000
IMAPS Best Paper of the Session
5th International Symposium and Exhibition on Advanced Packaging Materials – Processes, Properties, and Interfaces, IMAPS, March 1999, “Multi-Layered Structure: Adhesive Selection and Process Mechanics,” Manjula, S., Sundararaman, V., Sitaraman, S. K., Wong, C. P., Wu, J., and Pike, R. T.
Metro-Atlanta Engineer of the Year in Education Award
Suresh K. Sitaraman, Ph.D., 1999. Please see http://www.whistle.gatech.edu/archives/99/march/1
Outstanding Faculty Education Award
NSF Packaging Research Center – 1998
NSF CAREER Award
Suresh K. Sitaraman, Ph.D., 1997-2002
Student Awards and Honors
Surface Mount Technologies Association (SMTA) Hutchins Grant, 2014
Christine Taylor
First Place, Student Poster Competition, Glass Interposer Technology 2013 Workshop
Scott McCann
November 2013, Atlanta, Georgia; for the poster titled, “Fabrication Process and Modeling of Glass Interposers for Warpage Study,” by Scott McCann and Suresh K. Sitaraman
Sigma Xi, Best Doctoral Thesis Award, 2012
Gregory Ostrowicki
Intel Best Student Paper at 62nd ECTC
Sathyanarayanan Raghavan
Interlayer Dielectric Cracking in Back End of Line (BEOL) Stack by Sathyanarayanan Raghavan – Georgia Institute of Technology; Ilko Schmadlak – Freescale Semiconductor; and Suresh K. Sitaraman
First Place, Student Poster Competition, Glass Interposer Technology 2012 Workshop
Raphael Okereke
November 2012, Atlanta, Georgia; for the poster titled, “Mechanically Compliant Single-Path and Multi-Path Electrical Interconnects,” by Okereke, Bhat, Lee, Kacker, Lo, Xu, Zhu, and Suresh K. Sitaraman
Third Place, Student Poster Competition, Glass Interposer Technology 2012 Workshop
Xi Liu and Christine Taylor
November 2012, Atlanta, Georgia; for the poster titled, “Three-Dimensional Stacked Dies with Through Silicon Vias: In-situ Stress Characterization and Thermo-Mechanical Reliability Assessment,” by Xi Liu, Christine Taylor, and Suresh K. Sitaraman
First Place, Student Poster Competition, The Electronic and Photonic Packaging Division, ASME IMECE2010
Raphael Okereke
ASME 2010 International Mechanical Engineering Congress and Exposition (IMECE2010), November 2010, Vancouver, British Columbia, Canada; for the poster titled, “Parallel-Path Compliant Structures as Electrical Interconnects,” by Raphael Okereke, Karan Kacker, and Suresh K. Sitaraman
Second Place, Student Poster Competition, The Electronic and Photonic Packaging Division, ASME 2010 IMECE2010
Gregory Ostrowicki
ASME 2010 International Mechanical Engineering Congress and Exposition (IMECE2010), November 2010, Vancouver, British Columbia, Canada; for the poster titled, “Magnetically Actuated Peel Test for Interfacial Fracture and Fatigue Characterization,” by Greg Ostrowicki and Suresh K. Sitaraman.
Sam Nunn Security Program Fellow
Kevin Klein, Georgia Institute of Technology, 2006
Atlanta Surface Mount Technology Association (SMTA) Scholarship winner
Andrew Perkins, 2005
Atlanta Surface Mount Technology Association (SMTA) Scholarship winner
Shashi Hegde, 2005
Sigma Xi, Best Doctoral Thesis Award, 2004
Qi Zhu, 2004
SMTA Hutchins Grant
Andrew Perkins, 2003
First Place, Student Poster Competition, PRC/NSF, Fall 2003
George Lo, Qi Zhu, et al.
‘Compliant Interconnects,’ PRC/NSF, Fall 2003
Third Place, Student Poster Competition, PRC/NSF, Fall 2003
S. Hegde, et a.
‘Optoelectronic Reliability,’ , PRC/NSF, Fall 2003
Presidential Fellowship
A. Perkins, Fall 2000 – 2004
IMAPS Educational Foundation Scholarship
James Pyland, 2000-2001
IMAPS Educational Foundation Scholarship
Joe Haemer, 1999-2000
Presidential Fellowship
M. Modi, Fall 1999-2003
Onassis Foundation Scholarship
S. Michaelides, 1997-1999
Outstanding Poster Award (Graduate/ART) – Second Place – IAB/NSF Site Visit
R. Dunne
Thermo-Mechanical Modeling of SLIM, IAB/NSF Site Visit, Oct. 1997
Outstanding Poster Award (Undergraduate) – First Place – IAB/NSF Site Visit
C. Johnson O
Thermo-Mechanical Reliability of Vias – IAB/NSF Site Visit, Oct. 1997
Sigma Xi Undergraduate Research Award
Jill Conley
“Elastic-Plastic Modeling of Plated-Through Holes in Solder Shock Test.” 1996
Leventis Foundation Scholarship
S. Michaelides PhD Student, 1995-1997