Current Master’s Option
![](https://caspar.gatech.edu/files/2022/06/YiZhou.jpg)
Mechanical Testing and Characterization of Flexible Printed Electronics
Alumni Master’s Thesis Option:
![](https://caspar.gatech.edu/files/2022/06/mudasir.jpg)
Structural Thermal-Electric Modeling and Analysis of Micro-Springs for Microelectronic Probing and Packaging Applications
2001
![](https://caspar.gatech.edu/files/2022/06/Bhat-A.jpg)
Drop Studies of Compliant Interconnects
2012
![](https://caspar.gatech.edu/files/2022/06/isaacbower.jpg)
Mechanical Testing and Characterization of Flexible Printed Electronics
![](https://caspar.gatech.edu/files/2022/06/Phillip.jpg)
2017
![](https://caspar.gatech.edu/files/2022/06/Francis.jpg)
Asymmetric Thermal Profiles: A Different Approach to Accelerated Qualification of Chip Scale Packages
2003
![](https://caspar.gatech.edu/files/2022/06/jill.jpg)
Hygro-Thermo Mechanical Behavior of Fiber-Optic Apparatus
1998
![](https://caspar.gatech.edu/files/2022/06/manojb.jpg)
Physics-Based Reliability Assessment of Embedded Passives
2004
![](https://caspar.gatech.edu/files/2022/06/haemer_0.jpg)
Thermo-Mechanical Modeling and Design of Micro-springs for Microelectronic Probing and Packaging
2000
![](https://caspar.gatech.edu/files/2022/06/carlton.jpg)
Study of Thermo-Mechanical Reliability of Area-Array Packages
1999
![](https://caspar.gatech.edu/files/2022/06/richardharries.jpg)
Process Modeling and Interfacial Delamination in a Peripheral Array Package
1998
![](https://caspar.gatech.edu/files/2022/06/sashi_2_0.jpg)
Enhanced Thermomechanical Reliability of Microsystems Packaging through New Base Substrate and Dielectric Materials
2003
![](https://caspar.gatech.edu/files/2022/06/will-krieger.jpg)
Intefacial Delamination in Mold Compound
2014
![](https://caspar.gatech.edu/files/2022/06/AKwartra.jpg)
Epoxy Mold Compound and Copper
2016
![](https://caspar.gatech.edu/files/2022/06/kj.jpg)
Fabrication and Reliability of Embedded Passives in Organic Substrate
2005
![](https://caspar.gatech.edu/files/2022/06/George.jpg)
Electroplated Compliant High-Density Interconnects for Next-Generation Microelectronic Packaging
2004
![](https://caspar.gatech.edu/files/2022/06/Scottwb_0.jpg)
Glass Interposer Warpage
![](https://caspar.gatech.edu/files/2022/06/james_2.jpg)
Damage Metric Based-Thermal Cycling Guidelines For Area-Array Packages Used In Harsh Thermal Conditions
2002
![](https://caspar.gatech.edu/files/2022/06/Gnyan.jpg)
Physics-based Modeling Methodology for Reliability of Microvias
2002
![](https://caspar.gatech.edu/files/2022/06/kylesmith.jpg)
Thermo-Mechanical Behavior and Reliability of High-Density Interconnect (HDI) Vias
1997
![](https://caspar.gatech.edu/files/2022/06/yakin.jpg)
TSV grains
2017
![](https://caspar.gatech.edu/files/2022/06/manjulaa.jpg)
Palletization and Design-of-Simulations for Large Area Processing and Assembly in Electronic Packaging
1999
![](https://caspar.gatech.edu/files/2022/06/krishna2.jpg)
Experimental and Theoretical Assessment of PBGA Reliability in Conjunction with Field-Use Conditions
2004
Lucas McClasin
Methodology for Predicting Microelectronic Substrate Warpage Incorporating Copper Trace Pattern Characteristics
2008
Hernan Mercado-Corujo
Study of the Thermo-Mechanical Reliability of a Plated-Through-Hole / Press-Pin Assembly
2001
Sean Murphy
Thermo-Mechanical Reliability of the VSPA Package Solder Joints
1997
Rajiv Raghunathan
Virtual Qualification Methodology for Next-Generation Area- Array Devices
2000
Jorg Sizemore
Elastic-Plastic Modeling of PTH under Solder Shock Test
1996
Non-Thesis Master’s Alumni:
![](https://caspar.gatech.edu/files/2022/06/trilochan.jpg)
2015-18
![](https://caspar.gatech.edu/files/2022/06/Casey-1.jpg)
MAPT Temperature Control Experimental Setup and Procedure
2012
![](https://caspar.gatech.edu/files/2022/06/Raphael.jpg)
2009
![](https://caspar.gatech.edu/files/2022/06/nick.jpg)
2008
![](https://caspar.gatech.edu/files/2022/06/marc.jpg)
Thermo-mechanical Parametric Modeling and Reliability Studies for Lead Free Flip Chip Packages
2007
Employed at Elan Motosport Technologies*
![](https://caspar.gatech.edu/files/2022/06/thom.jpg)
Desing and Frabrication for High-Temperature Applications
2007
![](https://caspar.gatech.edu/files/2022/06/kevinb_1.jpg)
2006
![](https://caspar.gatech.edu/files/2022/06/seke.jpg)
Lead-Free Solder for High-Temperature Applications
2006
![](https://caspar.gatech.edu/files/2022/06/jamie_2_0.jpg)
2005
![](https://caspar.gatech.edu/files/2022/06/karanb.jpg)
2005
![](https://caspar.gatech.edu/files/2022/06/Uramela.jpg)
Alternate Base Substrate Materials
2003
Employed at Intel Corporation*
Kim Haynes
Thermo-Mechanical Studies
1997
Kyle Ray
Development of an Expert System for Flip-Chip Design
1996
Chris May
Joe May