Current Master’s Option
Mechanical Testing and Characterization of Flexible Printed Electronics
Alumni Master’s Thesis Option:
Structural Thermal-Electric Modeling and Analysis of Micro-Springs for Microelectronic Probing and Packaging Applications
2001
Drop Studies of Compliant Interconnects
2012
Mechanical Testing and Characterization of Flexible Printed Electronics
2017
Asymmetric Thermal Profiles: A Different Approach to Accelerated Qualification of Chip Scale Packages
2003
Hygro-Thermo Mechanical Behavior of Fiber-Optic Apparatus
1998
Physics-Based Reliability Assessment of Embedded Passives
2004
Thermo-Mechanical Modeling and Design of Micro-springs for Microelectronic Probing and Packaging
2000
Study of Thermo-Mechanical Reliability of Area-Array Packages
1999
Process Modeling and Interfacial Delamination in a Peripheral Array Package
1998
Enhanced Thermomechanical Reliability of Microsystems Packaging through New Base Substrate and Dielectric Materials
2003
Intefacial Delamination in Mold Compound
2014
Epoxy Mold Compound and Copper
2016
Fabrication and Reliability of Embedded Passives in Organic Substrate
2005
Electroplated Compliant High-Density Interconnects for Next-Generation Microelectronic Packaging
2004
Glass Interposer Warpage
Damage Metric Based-Thermal Cycling Guidelines For Area-Array Packages Used In Harsh Thermal Conditions
2002
Physics-based Modeling Methodology for Reliability of Microvias
2002
Thermo-Mechanical Behavior and Reliability of High-Density Interconnect (HDI) Vias
1997
TSV grains
2017
Palletization and Design-of-Simulations for Large Area Processing and Assembly in Electronic Packaging
1999
Experimental and Theoretical Assessment of PBGA Reliability in Conjunction with Field-Use Conditions
2004
Lucas McClasin
Methodology for Predicting Microelectronic Substrate Warpage Incorporating Copper Trace Pattern Characteristics
2008
Hernan Mercado-Corujo
Study of the Thermo-Mechanical Reliability of a Plated-Through-Hole / Press-Pin Assembly
2001
Sean Murphy
Thermo-Mechanical Reliability of the VSPA Package Solder Joints
1997
Rajiv Raghunathan
Virtual Qualification Methodology for Next-Generation Area- Array Devices
2000
Jorg Sizemore
Elastic-Plastic Modeling of PTH under Solder Shock Test
1996
Non-Thesis Master’s Alumni:
2015-18
MAPT Temperature Control Experimental Setup and Procedure
2012
2009
2008
Thermo-mechanical Parametric Modeling and Reliability Studies for Lead Free Flip Chip Packages
2007
Employed at Elan Motosport Technologies*
Desing and Frabrication for High-Temperature Applications
2007
2006
Lead-Free Solder for High-Temperature Applications
2006
2005
2005
Alternate Base Substrate Materials
2003
Employed at Intel Corporation*
Kim Haynes
Thermo-Mechanical Studies
1997
Kyle Ray
Development of an Expert System for Flip-Chip Design
1996
Chris May
Joe May