With the migration to lead-free solders, reliability of lead-free solder continues to be a concern in microelectronics industry. The CASPaR Lab has several projects that focus on various issues associated with lead-free solder. For example, intermetallic compound growth as well as microstructure evolution in flip-chip solder interconnects as well as ball-grid array solder balls continues to be a concern. CASPaR projects focus on 100-um to 200-um pitch flip-chip lead-free solder interconnects as well as 500-um pitch BGA interconnects under long-term thermal aging and thermal cycling. Finite-element models focus on the reliability of these interconnects under various loading conditions. Laser moiré interferometry as well as thermal cycling data are used to validate the finite-element model predictions. Long-term operational reliability is also studied through microstructural evolution as well as through other damage metric evolution.
- Microstructure Evolution in Lead Free Solder: BGAs and Flipchips
- Damage Metrics-Based Reliability Models
- Physics-Based Reliability Guidelines for Flip-Chip Devices (FCOB and FCOF)
- Reliability Assessment of a PBGA package
- Moire Interferometry and Fatigue Life Estimation
- Reworkable Underfills and BGA Reliability
- Lead-Free Microstructure Evolution Studies
- Thermal Cycling and Vibration Studies
