Current PhD Students
![](https://caspar.gatech.edu/files/2022/06/Justin.jpg)
Electroplated Nanowires as Thermal Interface Material
![](https://caspar.gatech.edu/files/2022/06/trilochan.jpg)
Study of Delamination of Bimaterials Under the Influence of Different Modes of Loading
![](https://caspar.gatech.edu/files/2022/06/BenStewart.jpg)
Mechanical Reliability and Characterization of Stretchable and Wearable Electronics
![](https://caspar.gatech.edu/files/2022/06/Christine.jpg)
Flip-chip Reliability Through Experimental Measurement
![](https://caspar.gatech.edu/files/2022/06/Casey-1.jpg)
Thermomechanical Reliability of Microfluidic Channels
Rui Chen
Alumni PhD:
![](https://caspar.gatech.edu/files/2022/06/Wei.jpg)
Compliant Interconnects
2015
![](https://caspar.gatech.edu/files/2022/06/dunne.jpg)
Thermo-Mechanical Reliability of a substrate with Integrated Passives
2000
![](https://caspar.gatech.edu/files/2022/06/nick.jpg)
Stress-engineered Superlayer for Fracture Studies
2014
![](https://caspar.gatech.edu/files/2022/06/sashi_2.jpg)
Investigation of Optical Changes in Siloxane Polymer Waveguides During Thermal Curing and Aging
2008
![](https://caspar.gatech.edu/files/2022/06/karanb.jpg)
Design and Fabrication of Free-Standing Structures as Off-Chip Interconnects
2008
![](https://caspar.gatech.edu/files/2022/06/injoong.jpg)
Development of a Knowledge Model for the Computer-Aided Design for Reliability of Electronic Packaging Systems
2008
![](https://caspar.gatech.edu/files/2022/06/Xi.jpg)
Experimental and Theoretical Assessment of Through-Silicon Vias for 3D Integrated Microelectronic Packages
2013
![](https://caspar.gatech.edu/files/2022/06/Dennis.jpg)
Thermo-Mechanical Reliability of High Density Stress-Engineered Compliant Interconnects for Electronic Packaging Application
2003
![](https://caspar.gatech.edu/files/2022/06/saketh1.jpg)
Study of Interfacial Crack Propogation in Flip Chip Assemblies with Nano-filled Underfill Materials
2005
![](https://caspar.gatech.edu/files/2022/06/Scottwb.jpg)
Glass Interposer Cracking
2017
![](https://caspar.gatech.edu/files/2022/06/stelios.jpg)
Physics-Based Process Modeling, Reliability Prediction and Design Guidelines for Flip-Chip Devices
1999
![](https://caspar.gatech.edu/files/2022/06/mitul_2.jpg)
Fracture in Stress Engineered High Density Thin Film Interconnects
2003
![](https://caspar.gatech.edu/files/2022/06/Raphael.jpg)
Electroplated multi-path compliant copper interconnects for flip-chip packages
2014
![](https://caspar.gatech.edu/files/2022/06/greg.jpg)
Magnetic Actuation for Fatigue Interfacial Delamination
2012
![](https://caspar.gatech.edu/files/2022/06/andy_0.jpg)
Investigation and Prediction of Solder Joint Reliability for Ceramic Area Array Packages under Thermal Cycling, Power Cycling, and Vibration Environments
2007
![](https://caspar.gatech.edu/files/2022/06/Raghavan.jpg)
Multilayer Substrate Warpage and Underbump Delamination
2014
![](https://caspar.gatech.edu/files/2022/06/Samet.jpg)
Copper-Epoxy Mold Compound Fatigue
![](https://caspar.gatech.edu/files/2022/06/Krishna.jpg)
Study of SnAgCu Alloy Reliability though Material Microstructure Evolution and Laser Moire Interferomety
2008
![](https://caspar.gatech.edu/files/2022/06/weidong2.jpg)
Thermo-Mechanical Evaluation of Interfacial Integrity in Multilayered Microelectronic Packages
2001
![](https://caspar.gatech.edu/files/2022/06/sai_zeng.jpg)
Knowledge-Based FEA Modeling for Highly-Coupled Variabel Topology Multi-Body Problems
2004
![](https://caspar.gatech.edu/files/2022/06/jiantao.jpg)
Interfacial Fracture of Micro thin Film Interconnects under Monotonic and Cyclic Loading
2008
![](https://caspar.gatech.edu/files/2022/06/Angela.jpg)
Helix-Type Compliant Off-Chip Interconnects for Microelectronic Packaging
2003