Low Cost MCM: Large Area Packaging using Small Area Substrates, Part 1
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:53Citation:
Bhattacharya, S., Baldwin, D., Sitaraman, S., Qu, J., Wong, C. P., Ume, I. C., and Tummala, R. R., "Low Cost MCM: Large Area Packaging using Small Area Substrates, Part 1,” High-Density Interconnect International, September, 2000, pp. 20-25.