Effect of Underfill on BGA Reliability
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:47Citation:
Pyland, J., Pucha, R., and Sitaraman, S. K., “Effect of Underfill on BGA Reliability,” 51st Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2001, pp. 85-90