Effect of Adhesive Layer Properties on Fracture in Thin Film High Density Interconnects
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:43Citation:
Modi, M. and Sitaraman, S.K. “Effect of Adhesive Layer Properties on Fracture in Thin Film High Density Interconnects,” 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 847-853.