Four-Laser Bending Beam Measurements and FEM Modeling of Underfill Induced Wafer Warpage
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:36Citation:
Zhang, Z., Fan, L., Sitaraman, S. K., and Wong, C.P. "Four-Laser Bending Beam Measurements and FEM Modeling of Underfill Induced Wafer Warpage," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 747-753