Materials, Processes and Reliability of Mixed-Signal Substrates for SOP Technology
Submitted by Caspar_admin on Fri, 01/03/2014 - 21:34Citation:
Mahalingam, S., Hegde, S., Ahmad, J., Pucha, R.V., Sundaram, V., Liu, F., White, G., Tummala, R., and Sitaraman, S.K., "Materials, Processes and Reliability of Mixed-Signal Substrates for SOP Technology," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 1630-1635