Role of Underfill Materials and Thermal Cycling on Die Stresses
Submitted by Caspar_admin on Fri, 01/03/2014 - 20:58Citation:
Hanna, C. and Sitaraman, S. K., “Role of Underfill Materials and Thermal Cycling on Die Stresses,” Advances in Electronic Packaging, EEP-Vol. 26-1, InterPACK 99, ASME, June 1999, pp. 795-801.