Design of Simulations Study of Multi-Layered Structures in Electronic Packaging
Submitted by Caspar_admin on Fri, 01/03/2014 - 20:56Citation:
Variyam, M. and Sitaraman, S. K., “Design of Simulations Study of Multi-Layered Structures in Electronic Packaging,” Advances in Electronic Packaging, EEP-Vol. 26-2, InterPACK 99, ASME, June 1999, pp. 1665-1671.