Three-Mask Fabrication and Optimized Design of First-Level Free-Standing Interconnect for Microelectronics Applications
Submitted by Caspar_admin on Fri, 01/03/2014 - 20:37Citation:
Zhu, Q., Ma, L., Lo, G., and Sitaraman, S. K., “Three-Mask Fabrication and Optimized Design of First-Level Free-Standing Interconnect for Microelectronics Applications” Proceedings of IMECE’03, 2003 ASME International Mechanical Engineering Congress, November 15-21, 2003, Washington, DC, IMECE2003-41833.