Thermo-Mechanical Reliability of Underfilled BGA Packages

Submitted by Caspar_admin on Mon, 11/25/2013 - 18:24

Citation:

Pyland, J., Pucha, R. V., and Sitaraman, S. K., “Thermo-Mechanical Reliability of Underfilled BGA Packages,” IEEE Transactions on Components and Packaging Technologies, Vol. 25, No. 2, April 2002, pp. 100-106.