Master's Students
Current Master's Thesis Option:
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Alumni Master's Thesis Option:
 Structural Thermal-Electric Modeling and Analysis of Micro-Springs for Microelectronic Probing and Packaging Applications 2001 |
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 Asymmetric Thermal Profiles: A Different Approach to Accelerated Qualification of Chip Scale Packages 2003 |
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 Thermo-Mechanical Modeling and Design of Micro-springs for Microelectronic Probing and Packaging 2000 |
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 Enhanced Thermomechanical Reliability of Microsystems Packaging through New Base Substrate and Dielectric Materials 2003 |
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 Electroplated Compliant High-Density Interconnects for Next-Generation Microelectronic Packaging 2004 |
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 Methodology for Predicting Microelectronic Substrate Warpage Incorporating Copper Trace Pattern Characteristics 2008 |
 Study of the Thermo-Mechanical Reliability of a Plated-Through-Hole / Press-Pin Assembly 2001 |
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 Damage Metric Based-Thermal Cycling Guidelines For Area-Array Packages Used In Harsh Thermal Conditions 2002 |
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 Palletization and Design-of-Simulations for Large Area Processing and Assembly in Electronic Packaging 1999 |
 Experimental and Theoretical Assessment of PBGA Reliability in Conjunction with Field-Use Conditions 2004 |
Non-Thesis Master's Alumni:
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 Thermo-mechanical Parametric Modeling and Reliability Studies for Lead Free Flip Chip Packages 2007 Employed at Elan Motosport Technologies* |
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