PhD Students

Current PhD:

Justin Chow
Electroplated Nanowires as Thermal Interface Material
David Samet
Copper-Epoxy Mold Compound Fatigue
Christine Taylor
Flip-chip Reliability Through Experimental Measurement
Casey Woodrum
Thermomechanical Reliability of Microfluidic Channels

Alumni PhD:

Wei Chen
Compliant Interconnects
2015
Rajiv Dunne
Thermo-Mechanical Reliability of a substrate with Integrated Passives
2000
Nicholas Ginga
Stress-engineered Superlayer for Fracture Studies
2014
Shashikant Hegde
Investigation of Optical Changes in Siloxane Polymer Waveguides During Thermal Curing and Aging
2008
Karan Kacker
Design and Fabrication of Free-Standing Structures as Off-Chip Interconnects
2008
Injoong Kim
Development of a Knowledge Model for the Computer-Aided Design for Reliability of Electronic Packaging Systems
2008
Xi Liu
Experimental and Theoretical Assessment of Through-Silicon Vias for 3D Integrated Microelectronic Packages
2013
Dennis Lunyu Ma
Thermo-Mechanical Reliability of High Density Stress-Engineered Compliant Interconnects for Electronic Packaging Application
2003
Sakerthraman Mahalingam
Study of Interfacial Crack Propogation in Flip Chip Assemblies with Nano-filled Underfill Materials
2005
Scott McCann
Glass Interposer Cracking
2017
Stelios Michaelides
Physics-Based Process Modeling, Reliability Prediction and Design Guidelines for Flip-Chip Devices
1999
Mitul Modi
Fracture in Stress Engineered High Density Thin Film Interconnects
2003
Raphael Okereke
Electroplated multi-path compliant copper interconnects for flip-chip packages
2014
Gregory Ostrowicki
Magnetic Actuation for Fatigue Interfacial Delamination
2012
Andrew Perkins
Investigation and Prediction of Solder Joint Reliability for Ceramic Area Array Packages under Thermal Cycling, Power Cycling, and Vibration Environments
2007
Sathyanarayanan Raghavan
Multilayer Substrate Warpage and Underbump Delamination
2014
Krishna Tunga
Study of SnAgCu Alloy Reliability though Material Microstructure Evolution and Laser Moire Interferomety
2008
Weidong Xie
Thermo-Mechanical Evaluation of Interfacial Integrity in Multilayered Microelectronic Packages
2001
Sai Zeng
Knowledge-Based FEA Modeling for Highly-Coupled Variabel Topology Multi-Body Problems
2004
Jiantao Zheng
Interfacial Fracture of Micro thin Film Interconnects under Monotonic and Cyclic Loading
2008
Angela Qi Zhu
Helix-Type Compliant Off-Chip Interconnects for Microelectronic Packaging
2003