Mechanical Reliability Assessment of 3-Arc-Fan Compliant Interconnects

Citation: 
Chen, W., Chung, P. Y., and Sitaraman, S. K., “Mechanical Reliability Assessment of 3-Arc-Fan Compliant Interconnects,” Chapter 2, Volume 3: Flexible Chip I/O Interconnects, Set 1: Interconnect and Wafer Bonding Technology, Encyclopedia of Packaging Materials, Processes, and Mechanics, Oct. 2019, World Scientific Publishing.