Flexible Chip I/O Interconnects, Set 1: Interconnect and Wafer Bonding Technology, Encyclopedia of Packaging Materials, Processes, and Mechanics

Citation: 
Chung, P. Y., Chen, W., and Sitaraman, S. K., “Design, Fabrication, and Assembly of 3-Arc-Fan Compliant Interconnects,” Chapter 1, Volume 3: Flexible Chip I/O Interconnects, Set 1: Interconnect and Wafer Bonding Technology, Encyclopedia of Packaging Materials, Processes, and Mechanics, Oct. 2019, World Scientific Publishing.