Flexible Chip I/O Interconnects, Set 1: Interconnect and Wafer Bonding Technology, Encyclopedia of Packaging Materials, Processes, and Mechanics

Citation: 
Muhannad S. Bakir and Suresh K. Sitaraman, Volume 3: Flexible Chip I/O Interconnects, Set 1: Interconnect and Wafer Bonding Technology, Encyclopedia of Packaging Materials, Processes, and Mechanics, Oct. 2019, World Scientific Publishing.