Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination

Citation: 
Kwatra, A., Samet, D., Rambhatla, V. N. N. T., and Sitaraman, S. K., “Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination,” Microelectronics Reliability 111, p. 113647, 2020