Multi-physics Modeling & Characterization of Components on Flexible Substrates

Citation: 
Sivapurapu, S., Chen, R., Mehta, C., Zhou, Y., Bellaredj, M., Jia, X., Kohl, P., Huang, T-C, Sitaraman, S. K., and Swaminathan, M., “Multi-physics Modeling & Characterization of Components on Flexible Substrates,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, 9(9), 2019, pp.1730-1740.