Interfacial Delamanination of Mold Compound in Fan-Out Packages

Citation: 
Rambhatla, V.T., Samet, D., Raj, P.M., Kawamoto, S., Tummala, R.R. and Sitaraman, S.K., “Interfacial Delamanination of Mold Compound in Fan-Out Packages,” 67th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Lake Buena Vista, FL, May 2017, pp. 827-833.