Low-Temperature Assembly of Surface-Mount Device on Flexible Substrate using Additive Printing Process

Citation: 
Taylor, C., He, X., Smet, V., Tentzeris, M. M., and Sitaraman, S. K., “Low-Temperature Assembly of Surface-Mount Device on Flexible Substrate using Additive Printing Process,” 68th Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2018.