Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging

Citation: 
Hauck, T., Schmadlak, I., Lakhera, N., Shantaram, S., Samet, D., Rambhatla, V.T. and Sitaraman, S., “Methods for Theoretical Assessment of Delamination Risks in Electronic Packaging” ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, Aug. 2017, San Francisco, CA, pp. V001T05A007-V001T05A007.