Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps

Citation: 
Sarvey, T. E., Hu, Y., Green, C. E., Kottke, P. A., Woodrum, D. C., Joshi, Y. K., Fedorov, A. E., Sitaraman, S. K., and Bakir, M. S., “Integrated Circuit Cooling Using Heterogeneous Micropin-Fin Arrays for Nonuniform Power Maps,” IEEE Transactions on Components, Packaging, and Manufacturing Technology, Vol. 7, No. 9, 2017, pp.1465-1475.