Shear Test on Hard-Coated Flip-Chip Bumps to Measure Back-End-of-the-line Stack Reliability

Citation: 
Raghavan, S. and Sitaraman, S. K., “Shear Test on Hard-Coated Flip-Chip Bumps to Measure Back-End-of-the-line Stack Reliability,” Engineering Fracture Mechanics, 2017, Vol. 178, pp. 1-13.