Scaling effect on Ag3Sn growth behaviours in micro-joints for flip chip assemblies

Citation: 
Tian, Y., Ren, N., Jian, X., Shang, S. and Sitaraman, S.K., “Scaling effect on Ag3Sn growth behaviours in micro-joints for flip chip assemblies,” Science and Technology of Welding and Joining, 2018, pp.1-7.