Cyclic magnetic actuation technique for thin film interfacial fatigue crack propagationSubmitted by Caspar_admin on Tue, 10/03/2017 - 13:55
Ostrowicki, G. T. and Sitaraman, S. K., “Cyclic magnetic actuation technique for thin film interfacial fatigue crack propagation,” Engineering Fracture Mechanics, Volume 168, Part A, December 2016, Pages 1–10.
Interfacial fatigue crack characterization is challenging for as-deposited thin films due to issues with fixturing and precision application of cyclic loading. A fixtureless and microfabricated test technique is presented to characterize delamination propagation rate as a function of constant amplitude fatigue loading using a novel peel test configuration and magnetic actuation. The test was demonstrated for 1.6 μm thick Cu films on a Si substrate, where interfacial fatigue crack propagation was observed to follow Paris Law behavior.