Glass Interposer Cracking
The objective of this project is to design and demonstrate glass interposer with low warpage and no cracking. Glass has high modulus and low, tailorable CTE, in addition to superior electrical properties, that allow for low warpage of thin packages. As a brittle material, glass can crack, however, this work will demonstrate solutions to glass cracking. Furthermore, double-sided, panel-level fabrication processes to fabricate glass interposers make it a lower cost technology than silicon, which relies on expensive, low-volume BEOL fabrication wafer-level processes at 300 mm wafer size.