Thermo-Mechanical Reliability of a ‘Sandwich’ Substrate with Integrated Passives

Citation: 
Dunne, R. C. and Sitaraman, S. K., “Thermo-Mechanical Reliability of a ‘Sandwich’ Substrate with Integrated Passives”, VIII International Congress on Experimental Mechanics and Experimental/Numerical Mechanics in Electronics Packaging, Nashville, TN, June 10-13, 1996, pp. 19-20.