Thermo-Mechanical Analysis of Solder Joint Fatigue and Creep in a Flip Chip on Board Package Subjected to Temperature Cycling Loading

Citation: 
Pang, H. L. J., Tan, T., and Sitaraman, S. K. “Thermo-Mechanical Analysis of Solder Joint Fatigue and Creep in a Flip Chip on Board Package Subjected to Temperature Cycling Loading,” 48th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Seattle, WA, May 1998, pp. 878-883.