Use of Highly Compliant Adhesives in the Large Area Processing of MCM-D Substrates

Citation: 
Sitaraman, S. K., Sundararaman, V., Manjula, S., Wong, C. P., Lu, D., Pike, R. T., Meyers, L., “Use of Highly Compliant Adhesives in the Large Area Processing of MCM-D Substrates,” 48th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Seattle, WA, May 1998, pp. 895-899.