Multi-Layered Structure: Adhesive Selection and Process Mechanics

Citation: 
Manjula, S., Sundararaman, V., Sitaraman, S. K., Wong, C. P., Wu, J., and Pike, R. T., “Multi-Layered Structure: Adhesive Selection and Process Mechanics,” 5th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS-IEEE, Braselton, GA, March 1999, pp. 48-52.