Numerical and Experimental Investigation of Large IC Flip Chip Attach

Citation: 
Schubert, A., Dudek, R., Leutenbauer, R., Coskina, P., Becker, K. –F., Kloeser, H., Reichl, D., Baldwin, D., Qu, J., Swaminathan, M., Wong, C. P., Tummala, R., and Sitaraman, S. K., “Numerical and Experimental Investigation of Large IC Flip Chip Attach,” 50th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, May 2000, pp. 1338-1346.