Low Cost MCM: Large Area Packaging using Small Area Substrates, Part 2

Citation: 
Bhattacharya, S., Baldwin, D., Sitaraman, S., Qu, J., Wong, C. P., Ume, I. C., and Tummala, R. R., "Low Cost MCM: Large Area Packaging using Small Area Substrates, Part 2,” High-Density Interconnect International, October 2000, pp. 36-39.