Implantable Medical Devices and Next-Genertion Microsystems Packaging: An Integrated Process Modeling Approach to High Reliability and Miniaturization

Citation: 
Sitaraman, S. K., Dunne, R. C., Raghunathan, R., and Xie, W., “Implantable Medical Devices and Next-Genertion Microsystems Packaging: An Integrated Process Modeling Approach to High Reliability and Miniaturization,” NSF Design and Manufacturing Grantees Conference, Tampa, FL, Jan. 7-10, 2001.