Novel Nanospring Interconnects for High-Density Applications

Citation: 
Ma, L., Zhu, Q., Sitaraman, S. K., Chua, C., and Fork D. K., “Novel Nanospring Interconnects for High-Density Applications,” 7th International Symposium and Exhibition on Advanced Packaging Materials - Processes, Properties, and Interfaces, IMAPS-IEEE, Braselton, GA, March 2001, pp. 372-378.