Stress-engineered metal interconnects

Citation: 
Fork, D. K., Chua, C. L., Wong, L., Alimonda, A. S., Smith, D. L., Modi, M., Zhu, Q., Ma, L., and Sitaraman, S. K., “Stress-engineered metal interconnects”, Proceeding of 2001 International Conference on High-Density Interconnect and System Packaging, Santa Clara, CA, USA, April, 2001.