-Springs - Innovative Compliant Interconnects for Next-Generation Packaging

Citation: 
Ma, L., Qi, Z., Hantschel, T., Fork, D. K., and Sitaraman, S.K. “J-Springs - Innovative Compliant Interconnects for Next-Generation Packaging,” 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 1359-1365.