ptimal Design of an Integrated Substrate Based On the Analysis of Warpage and Delamination

Citation: 
Hu, H. and Sitaraman, S.K. “ Optimal Design of an Integrated Substrate Based On the Analysis of Warpage and Delamination,” 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 941-946.