Role of Substrate and Dielectric Materials on the Thermo mechanical Reliability of Microvias

Citation: 
Ramakrishna, G., Liu , F., and Sitaraman, S.K. “Role of Substrate and Dielectric Materials on the Thermo mechanical Reliability of Microvias,” 52nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May 2002, pp. 439-445.