Time Evolution of Temperature Distribution of a Flip-Chip No-Flow Underfill Package during Solder Reflow Process

Citation: 
Zhang, Z., Vorakunpinij, A., Sitaraman, S.K., and Wong, C. P., “Time Evolution of Temperature Distribution of a Flip-Chip No-Flow Underfill Package during Solder Reflow Process ,” 53nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, New Orleans, LA, May 2003, pp. 443-451.