Thermo-Mechanical Failure Comparison and Evaluation of CCGA and CBGA Electronic Packages

Citation: 
Perkins, A., and Sitaraman, S.K. “Thermo-Mechanical Failure Comparison and Evaluation of CCGA and CBGA Electronic Packages,” 53nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, New Orleans, LA, May 2003, pp. 422-430.