Four-Laser Bending Beam Measurements and FEM Modeling of Underfill Induced Wafer Warpage

Citation: 
Zhang, Z., Fan, L., Sitaraman, S. K., and Wong, C.P. "Four-Laser Bending Beam Measurements and FEM Modeling of Underfill Induced Wafer Warpage," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 747-753