Design, Fabrication, and Reliability Testing of Embedded Optical Interconnects on Package

Citation: 
Hegde, S., Pucha, R.V., Guidotti, D., Liu, F., Chang, Y.J., Tummala, R., Chang, G. and Sitaraman, S. K., "Design, Fabrication, and Reliability Testing of Embedded Optical Interconnects on Package," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 895-900