Accelerated Thermal Cycling: Is it Different for Lead-free Solder?

Citation: 
Tunga, K., Kacker, K., Pucha, R.V., and Sitaraman, S.K., "Accelerated Thermal Cycling: Is it Different for Lead-free Solder?," 54th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Las Vegas, NV, June 2004, pp. 1579-1585