Recent Advances in Composite Substrate Materials for High-Density and High-Reliability Packaging Applications

Citation: 
Kumbhat, N., Raj, P. M., Pucha, R. V., Atmur, S., Doraiswamy, R., Sundaram, V., Bhattacharya, S., Sitaraman, S.K., and Tummala, R. "Recent Advances in Composite Substrate Materials for High-Density and High-Reliability Packaging Applications," ," 55th Electronic Components and Technology Conference, IEEE-CPMT and EIA, Orlando, FL, May 2005, pp. 1364-1372.