Unified Finite Element Model for Prediction of Solder Joint Fatigue Under Thermal, Power, and Vibration Environments for Ceramic Area Array Electronic Packages

Citation: 
Perkins, A. and Sitaraman, S.K. "Unified Finite Element Model for Prediction of Solder Joint Fatigue Under Thermal, Power, and Vibration Environments for Ceramic Area Array Electronic Packages," 2007 Surface Mount Technology Association International (SMTAI) Conference Proceedings, Orlando, FL, Oct. 2007, p. 460-478.