Thermo-mechanical Behavior of Through Silicon Vias in a 3D Integrated Package with Inter-chip Microbumps

Citation: 
Liu, X., Chen, Q., Sundaram, V., Simmons-Matthews, M., Wachtler, K.P., Tummala, R.R., and Sitaraman, S.K., "Thermo-mechanical Behavior of Through Silicon Vias in a 3D Integrated Package with Inter-chip Microbumps," 61st Electronic Components and Technology Conference, IEEE-CPMT and EIA, Lake Buena Vista, FL, May-June 2011, pp. 1190-1195.