Interlayer Dielectric Cracking in Back End of Line (BEOL) Stack

Citation: 
Raghavan, S., Schmadlak, I., and Sitaraman, S. K., “Interlayer Dielectric Cracking in Back End of Line (BEOL) Stack,” 62nd Electronic Components and Technology Conference, IEEE-CPMT and EIA, San Diego, CA, May-June 2012, pp. 1467-1474.